发明名称 HIGH-MOLECULAR POLYAMIDE COMPOSITION WITH IMPROVED FLOW BEHAVIOUR
摘要 The invention relates to a polyamide composition with improved flow behaviour that comprises at least 80-99.5 wt.% of a high-molecular polyamide and 0.5-20 wt.% of a polyamide oligomer that has a melting point that is higher than the melting point of the high-molecular polyamide, the amounts being relative to the total weight of the polyamide present in the composition. The high-molecular polyamide is preferably PA-6 or PA-4,6/6 copolymer and the polyamide oligomer is preferably chosen from the group comprising PA-6,6, PA-4,6, PA-4,6/6 copolyamide or copolyamides or mixtures thereof. The invention also relates to a process for improving the flow behaviour of a high-molecular polyamide composition by melt-mixing a high-molecular polyamide and a polyamide oligomer having a melting point that is higher than the melting point of the high-molecular polyamide at a melt temperature that is equal to or lower than the melting point of the polyamide oligomer and also a high-molecular polyamide composition obtainable with this process.
申请公布号 WO0075233(A1) 申请公布日期 2000.12.14
申请号 WO2000NL00339 申请日期 2000.05.19
申请人 DSM N.V.;KONING, CORNELIS, EME;DE KONING, GERARDUS, JOHANNES, MARIA;CREVECOEUR, JEROEN, JOOST 发明人 KONING, CORNELIS, EME;DE KONING, GERARDUS, JOHANNES, MARIA;CREVECOEUR, JEROEN, JOOST
分类号 C08K7/14;C08L77/00;C08L77/02;C08L77/06;(IPC1-7):C08L77/00 主分类号 C08K7/14
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