发明名称 SOLDER JOINT METHOD FOR INSULATED WIRE AND TERMINAL
摘要 PROBLEM TO BE SOLVED: To jointing a terminal and an insulated wire with solder uniformly and stably by winding the insulated wire around a solder-coated terminal and irradiating the wound part with a laser beam. SOLUTION: A predetermined amount of cream solder 2 is discharged or coated onto a predetermined upper surface of a terminal 1. The solder 2 is heated with a hot plate to be temporarily melted. Thus, the surface of the solder 2 is made substantially uniform, so that the subsequent operation of winding an insulated wire 3 is facilitated. In addition, the absorbing rate of a laser beam 4 at the soldering surface is also made uniform during the irradiation of the beam 4 so that the solder joint is stabilized. Next, the wire 3 is wound around predetermined regions of a bobbin 5 and the terminal 1. Successively, the converged beam 4 is injected onto a predetermined surface of the terminal 1, whereby, while melting the solder 2 with the heat of the beam 4 and while destroying or melting the insulation sheath of the wire 3, the terminal 1 and the wound wire 3 are jointed with the solder. As a result, a uniform and stable solder joint can be obtained.
申请公布号 JP2000299239(A) 申请公布日期 2000.10.24
申请号 JP19990109354 申请日期 1999.04.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAUCHI KOSUKE;OSHIMA YUMIKO;WADA HIROSHI;OZAKI HIROMASA
分类号 H01F41/10;B23K1/00;B23K1/005;B23K1/20;(IPC1-7):H01F41/10 主分类号 H01F41/10
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