| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump bonder and a method of inspecting bumps, which checks the quality of the bump shape and detects nondelivered bumps, without contacting them in bonding the bumps to a semiconductor chip. SOLUTION: This bonder comprises a bump forming head 110, an ultrasonic horn driver 125, a current detector 121 and a bonding controller 511. The current detector detects a current flowing, while the head 110 is driven through an actuator to form bumps on electrodes, the bonding controller compares this current with a normal current value to determine the quality of the bump shape and of adhesion to the electrode. Thus the bump can be inspected every time a bump is formed, without having an inspecting apparatus make direct contact with semiconductor components. |
