发明名称 |
Three-dimensional surface structure inspection device e.g. for surface mount technology (SMT) circuit board solder application |
摘要 |
An inspection device examines three-dimensional surface structures of mainly flat test items (3) by means of a camera (8). An optical sensor (7) is provided for carrying out three-dimensional detection of at least a part-zone of the test item surface, with the sensor (7) and the camera (8) combined in a sensor unit (6). A calibration mark (16) is fixed on the inspection device independent of the test-item (3) and enables the position of the camera (8) and the optical sensor (7) to be determined after photographing an object or after measuring the calibration mark (16).
|
申请公布号 |
DE19915052(A1) |
申请公布日期 |
2000.10.05 |
申请号 |
DE1999115052 |
申请日期 |
1999.04.01 |
申请人 |
SIEMENS AG |
发明人 |
BELLM, HUBERT;LISTL, LUDWIG |
分类号 |
H05K13/04;H05K13/08;(IPC1-7):G01B11/00;G06K9/62;G01J1/04 |
主分类号 |
H05K13/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|