| 摘要 |
<p>A multiple-chip module comprising a plurality of semiconductor chips such as bare chips and packaged chips mounted on a circuit board. The semiconductor chips are covered with a heat sink on top, and the gaps between the heat sink and the circuit board are filled with resin. Since the semiconductor chips are bonded together by the resin to disperse stresses that some chips may suffer, the chips and the heat sink can be protected from damage due to the concentration of stresses. The resin between the semiconductor chips and the heat sink makes the contact between them easy even if the chips have different sizes. Further, all the chips and the heat sink are bonded in a single process.</p> |
