| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor light receiving device, in which a photoelectric conversion element is combined with an IC in a structure reduced in cost in-crease and is hardly affected by noise. SOLUTION: This semiconductor light receiving device is constituted of a photoelectric conversion element 1, which receives a signal light and a semiconductor integrated circuit(IC) 2 which amplifies and/or signal-processes a signal received by the photoelectric conversion element 1. They are both connected directly through bumps 18 and 19 and 21 and 22 on a circuit substrate 3. In the photoelectric conversion element 1, a photoelectric conversion part which is the junction part of a p-type layer 12 and an n-type layer 13 is formed on the surface side of a semiconductor substrate 11, and the bumps 18 and 19 connected with the p-type layer 12 and the n-type layer 13 are formed on the surface, and the semiconductor substrate 11 at the lower side of the photoelectric conversion part (p-n conjunction) is etched, so that a recess 11a can be formed.</p> |
