发明名称 |
RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto |
摘要 |
An RF tag for inclusion in a smart label comprises a stiff substrate sized to be received in the smart label, an antenna carried by the substrate and an integrated circuit having a memory circuit carried by the substrate and coupled to the antenna by wire bonding. The substrate may be strain relieved, for example, by forming a pair of generally opposed serpentine edges on the substrate, or forming a plurality of grooves in at least one surface of the substrate. A smart label comprises the RF tag between a face sheet and an adhesive. A release liner may cover the adhesive. A compressably deformable material having a low viscoelastic modulus is received between the first surface of the substrate and the face sheet partially surrounding the circuit structure and wire bonds to hydrostatically protect against damage. A film layer with a blister may envelop the low viscoelastic modulus material.
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申请公布号 |
US6114962(A) |
申请公布日期 |
2000.09.05 |
申请号 |
US19980173137 |
申请日期 |
1998.10.15 |
申请人 |
INTERMEC IP CORP. |
发明人 |
WIKLOF, CHRISTOPHER A.;HUGH, STEVEN C. |
分类号 |
G06K19/077;G08B13/24;H01Q1/22;H01Q9/16;H01Q9/28;(IPC1-7):G08B13/187 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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