| 摘要 |
PROBLEM TO BE SOLVED: To position a plurality of wafer chucks provided in an index table to a position of grinding by a grinding wheel, with a high degree of accuracy. SOLUTION: In a plane machining device for a wafer, an index table 50 is coupled with a table motor 84 through the intermediary of an electromagnetic clutch 82. After the power of the table motor 83 is cut off by this electromagnetic clutch 82, a locating pin 94 is fitted in a positioning hole 100 formed in the index table 50 so as to position and fix chucks 48, 52. Further, inclined surfaces for guiding the locating pin 94 into the positioning hole 100 are formed in the front end part of the locating pin 94 and the inlet part of the positioning hole 100, and accordingly, deviated positions of the chucks 48, 52 can be corrected so as to locate the chucks 48, 52 to the polishing machining position.
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