| 摘要 |
PROBLEM TO BE SOLVED: To suggest a land shape which enables accurate soldering at a specified position without moving an electronic part to be mounted even if some impact and vibration are applied to a printed substrate during solder reflow, and makes it possible to recognize visually and optically whether or not solder is good by forming a fillet tapered long. SOLUTION: A land 2 is formed slightly larger than a collector terminal 6a and a part of a circumferential edge of the land 2 is provided with an opening part 7 whose opening is larger than a depth. Consequently, movement of an electronic part (such as a power mold transistor 6) is restrained and it can be soldered at a specified position. Since a fillet 8 tapered long can be formed in an opening part 7, it is possible to recognize visually and optically whether or not soldering is good.
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