Laminate sticking type chip thermistor manufacturing method, involves laminating and fixing elements in brake groove during simultaneous cutting of motherboards

摘要

A first ohmic electrode (14) and a second ohmic electrode are formed on a motherboard. The insulating materials (5) are installed between motherboards, such that brake grooves (11) are arranged in the thickness direction of a motherboard. The motherboard (13) is cut, such that laminate fixing of elements (17) in the brake groove is performed. The brake grooves are formed on a motherboard. A first ohmic electrode is formed extending from one surface to the first side of a motherboard. A second ohmic electrode is formed extending continuously from the second side to another surface of a motherboard.