| 摘要 |
In a method for producing adhesive coated foil, a surface of a conductive foil is first coated with an adhesive layer which includes at least some u-v curable adhesive material, after which a second adhesive layer is applied, which includes thermally curable adhesive material. The thermally curable material of the second adhesion layer is then semi-cured. Preferably, the u-v curable adhesive material of the first adhesive layer is then cured by irradiation with u-v radiation through the semi-cured second adhesive layer. The surface of the semi-cured second adhesive layer may be applied to a substrate which may be used to form a printed circuit board. |
