发明名称 SILICA FILM-FORMING SOLUTION COMPOSITION AND MANUFACTURING METHOD
摘要 PURPOSE: Silica film formation solution compositions and a method for manufacturing the same are provided to achieve much improved density to be used for coating films without additional treatments. CONSTITUTION: Silica film formation solution compositions are manufactured by mixing: a first silica film formation solution that is hydrolyzed at 45 to 60 deg.C for 20-60 hours, and contains containing silicon alkoxide, 2-10 mol% of water, 3-7 times of a solvent based on silicon alkoxide, the solvent selected from alcohol, ester, ketone, and aromatic carbon hydroxide, and inorganic catalyst having the initial pH between 1.0 and 3.5; and 30-70 vol% of a secondary silica film formation solution that is hydrolyzed at 45 to 60 deg.C for 4-20 hours, and contains containing silicon alkoxide, 2-10 mol% of water, 3-7 times of a solvent based on silicon alkoxide, the solvent selected from alcohol, ester, ketone, and aromatic carbon hydroxide, and organic catalyst having the initial pH between 1.0 and 3.5.
申请公布号 KR100251654(B1) 申请公布日期 2000.04.15
申请号 KR19920024486 申请日期 1992.12.16
申请人 SAMSUNG CORNING CO.,LTD 发明人 PAK, HYUN-SU;WOO, KYUNG-KUN;SEO, HYUNG-WON
分类号 C09D1/00;C09D183/02;(IPC1-7):C09D1/00 主分类号 C09D1/00
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