发明名称 TESTING SOCKET FOR BOTTOM LEAD PACKAGE
摘要 PURPOSE: A socket for inspecting a bottom leaded package is provided to insert/extract the package into/from the socket by forming the body and the cap of the socket in one. CONSTITUTION: A package setting unit(11) is formed on a lower base(10) by a certain depth. A plurality of connection pins within the lower base(10) contacts with the external terminal placed on the package setting unit(11) to connect a board for inspecting. Being in one with an opening(21) for inserting a package(P) formed on the upper surface of the lower base(10), a pressing plate(20) presses a connecting pin(12) to elevate the package(P) by a predetermined height. A package fixing member(30) is coupled with the lower base to be capable of rotating, and separated from the package(P) when the pressing plate(20) is pressed. The upper side of the connection pin(12) is bent so as to push up the package(P).
申请公布号 KR100253400(B1) 申请公布日期 2000.04.15
申请号 KR19970080679 申请日期 1997.12.31
申请人 HYUNDAI MICRO ELECTRONICS CO.,LTD. 发明人 CHUNG, HWAN MOON
分类号 G01R31/26;H01L21/66;(IPC1-7):H01L23/32 主分类号 G01R31/26
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