| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor plastic package with superior connection between an inner-layer metal core and an outer layer metal foil, heat radiation, heat resistance, after moisture absorption, etc. SOLUTION: In a semiconductor plastic package with a ball grid array using both-sided truncated conical metal cores with both surfaces, truncated conical protrusions on the front surface and the rear surface are individually exposed between semiconductor chip mounted metal foils a and between metal foils for ball pads, respectively. After a desmearing treatment of the exposed metal surfaces, the entire surfaces are metal-plated and coated with a plating resist, excluding a semiconductor chip mounting part g, the bonding pad parts and ball pad parts. In the printed wiring board obtained by plating with a noble metal h, a metal core c and a through-hole f are insulated by a thermosetting resin composition such as multifunctional cyanate ester, etc. A semiconductor chip is fastened on one surface of the wiring board with a heat-conductive adhesive and the chip, wires and bonding pads are resin-sealed in this semiconductor plastic package.
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