PACKAGING FORM OF OPTICAL SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a packaging formed of an optical semiconductor module capable of corresponding to the trend toward multiple terminals of electric terminals and optical terminals by effectively utilizing a packageable area on a packaging substrate. SOLUTION: The optical semiconductor module includes optical semiconductor elements, such as surface light emitting semiconductor elements 11a and surface light receiving semiconductor elements 11b, etc., a module substrate 12 to be mounted with these elements, the optical terminals 13 constituting the optical input and output portions of the optical semiconductor module and the electric terminals 14 constituting the electric input and output portions of the optical semiconductor module. The optical terminals 13 and electric terminals 14 are both arranged on the substrate mounting surface 18 for mounting the optical semiconductor module. The optical input and output and the electric input and output are aligning to the same direction with respect to the substrate mounting surface 18 and are made perpendicular to the substrate mounting surface 18.