METALLIZATION OF NON-CONDUCTORS

摘要

The invention provides a process for enabling direct metallization of nonconductors. Strongly-adherent insoluble polymeric products are deposited in one process step on the surface of the nonconductor from an acidic aqueous solution (optionally containing a solubilizer) of initially-nonconductive oligomers, monomer/oligomer mixtures, or monomers or mixtures of monomers of five-membered heterocycles, by contact with a non-rinsable insoluble coating containing manganese dioxide which has been adsorbed on the surfaces of the nonconductor from a solution containing permanganates. The electrical conductance of the polymeric products is sufficient to permit deposition of metal on the polymer surface from galvanic baths through application of an electrical current.