发明名称 ETCHING DEVICE AND METHOD FOR OPERATING THE SAME AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an etching device equipped with a handling arm for reducing any foreign matter accumulated on the surface of the handling arm and for easily removing the foreign matter, and a method for operating the etching device, and a method for manufacturing a semiconductor device. SOLUTION: This is an etching device equipped with a handling arm 1 for carrying a wafer to an etching chamber. A heater 2 and a thermometer 3 are embedded in a handling arm main body 1a of the handling arm 1. Also, a method for operating the etching device includes an operating process for cleaning the handling arm 1 in a state that the handling arm 1 is set at a carrying arm driving body 4 without being removed from the carrying arm driving body 4.
申请公布号 JPH11354503(A) 申请公布日期 1999.12.24
申请号 JP19980158694 申请日期 1998.06.08
申请人 HITACHI LTD 发明人 SUZUKI SHINICHI;FUKADA MASAO;KITSUNAI HIROYUKI;TSUMAKI NOBUO
分类号 C23F4/00;H01L21/302;H01L21/3065;H01L21/677;H01L21/68;(IPC1-7):H01L21/306 主分类号 C23F4/00
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