发明名称 |
ETCHING DEVICE AND METHOD FOR OPERATING THE SAME AND MANUFACTURE OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an etching device equipped with a handling arm for reducing any foreign matter accumulated on the surface of the handling arm and for easily removing the foreign matter, and a method for operating the etching device, and a method for manufacturing a semiconductor device. SOLUTION: This is an etching device equipped with a handling arm 1 for carrying a wafer to an etching chamber. A heater 2 and a thermometer 3 are embedded in a handling arm main body 1a of the handling arm 1. Also, a method for operating the etching device includes an operating process for cleaning the handling arm 1 in a state that the handling arm 1 is set at a carrying arm driving body 4 without being removed from the carrying arm driving body 4. |
申请公布号 |
JPH11354503(A) |
申请公布日期 |
1999.12.24 |
申请号 |
JP19980158694 |
申请日期 |
1998.06.08 |
申请人 |
HITACHI LTD |
发明人 |
SUZUKI SHINICHI;FUKADA MASAO;KITSUNAI HIROYUKI;TSUMAKI NOBUO |
分类号 |
C23F4/00;H01L21/302;H01L21/3065;H01L21/677;H01L21/68;(IPC1-7):H01L21/306 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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