发明名称 |
Resin-Filler composite and production method thereof |
摘要 |
The present invention relates to a composite of resin and fillers used in electronic parts and structural parts, and to a process for producing the same, and the object of the present invention is to provide a resin composite with a molded body having high dimensional accuracy, being free of surface defects attributable to a mold used for molding and being capable of easy forming and mass production, as well as a process for producing the same. The process for producing a resin composite according to the present invention comprises a step of mixing fillers of an average particle diameter of 40 mu m or less with thermosetting resin, a step of compression molding this mixed powder into a predetermined shape at ordinary temperature, and a step of allowing the compression molded body after released from the mold to be hardened by heating at 100 to 250 DEG C. to give a hardened molded body.
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申请公布号 |
US5990222(A) |
申请公布日期 |
1999.11.23 |
申请号 |
US19970999369 |
申请日期 |
1997.12.29 |
申请人 |
KYOCERA CORPORATION |
发明人 |
WATADA, KAZUO;FUJIOKA, YOICHI;TANDA, HIROKO;ENOKIDA, KOJI;NAKAMURA, SAEKI |
分类号 |
C08K3/00;(IPC1-7):C08K3/00 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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