Semiconductor device and method for making same

摘要

A semiconductor device comprises a packaged semiconductor (50) having an opening (16) forming an exposed face by partially exposing (11) the semiconductor element (9), a dummy land (10) on the circuit substrate (1) provided in a position corresponding to the mounting position of the packaged semiconductor (50), and a connecting material (3a) placed between the exposed face (11) and the dummy land (10) to tightly fasten the members to each other. Damage and breaks in the lead of the mounted packaged semiconductor can be prevented, and reliability improved. Also, no additional steps are required in the manufacturing process.