发明名称 |
Apparatus for polishing substrate using resin film or multilayer polishing pad |
摘要 |
An elastic polishing pad is adhered to the top face of a rotatable table. Above the table is provided a substrate holding apparatus for holding a substrate. The substrate holding apparatus comprises a rotary shaft, a substrate holding head in the form of a disc which is provided integrally with the lower edge of the rotary shaft, a sealing member in the form of a ring which is made of an elastic material and fastened to the peripheral portion of the lower face of the substrate holding head, and a guiding member in the form of a ring which is fastened to the back face of the substrate holding head to be located outside the sealing member. A fluid under pressure is introduced into a fluid flow path formed in the rotary shaft from one end thereof and supplied to a space from the other end of the fluid flow path so as to press the substrate against the polishing pad.
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申请公布号 |
US5921853(A) |
申请公布日期 |
1999.07.13 |
申请号 |
US19970811355 |
申请日期 |
1997.03.04 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHIO, MIKIO |
分类号 |
B24B37/04;B24B57/02;(IPC1-7):B24B29/02;B24B49/12;B24D11/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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