| 摘要 |
PROBLEM TO BE SOLVED: To provide a board processor capable of reduction of the area of an occupied floor, the improvement of reliability, and the cost reduction. SOLUTION: A device body 1 is placed on floor material 200. An underfloor cabinet 100 is attached right below the floor material 200 under the device body 1. The underfloor cabinet 100 is constituted of member having permeability. A part of the constituent unit of a fluid facility, an exhaust facility, an intake facility, an electric facility, etc., is accommodated in the underfloor cabinet 100. The floor material 200 on the underfloor cabinet 100 is provided with a hole 201, and a conduit 101 to connect the underfloor cabinet 100 with the device body 1 is provided within the hole 201. A pipe and wiring to connect the constituent unit accommodated in the underfloor cabinet 100 with the device body 1 are inserted in the conduit 101. |
