CHIP ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a chip electronic component by which the area of plated layer to be formed on a surface electrode can be made larger and the fitting strength to circuit substrate be prevented from being lower. SOLUTION: An overcoat 10 is formed in such a manner that exposing parts 2b are formed, while overlapping parts 2a are exposed on a pair of surface electrodes 5a of a resistor (electrical element) 2. A plating layer is formed entirely over the exposing parts 2b in such a manner that its end is brought into contact with the overcoat 10. Thus the overcoat can be prevented from extruding on the surface electrode from the end of the electrical element. Further, since the end of the overlapping part of electric element is exposed, the plating layer covering the surface electrode can be formed on the end part of the overlapping part thereof, thereby making the area for plating layer on the surface electrode larger.