| 摘要 |
<p>In a chip-size package, a low-elasticity elastomer (2) which relieves and absorbs the stresses concentrated upon bump electrodes (5) is formed on the main surface of a semiconductor chip (1), and the wiring (4) connected to bonding pads (7) is led out to the upper surface of the elastomer (2) by way of through holes formed through the elastomer (2) and connected to the bump electrodes (5). The stresses concentrated upon the bump electrodes (5) are absorbed and relieved by not only the elastomer (2), but also the expansion and contraction of the wiring (4) led out to the upper surface of the elastomer (2) by laying the wiring (4) in a curved pattern.</p> |
