首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Hydromechanical transmission for rail vehicle
摘要
Has hydraulic connection to lubricating pump to move the output drive shaft if the gear wheels baulk during gear change
申请公布号
DE19846554(A1)
申请公布日期
1999.05.12
申请号
DE1998146554
申请日期
1998.10.09
申请人
VUKV A.S., PRAG/PRAHA, CZ
发明人
BYSTRICKY, ANTONIN, DIPL.-ING., PRAHA, CZ
分类号
B61C9/14;B61C9/34;B61C9/42;F16H61/00;F16H63/30
主分类号
B61C9/14
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Chroman-derived anti-androgens for treatment of androgen mediated disorders
1-1-Oxo-1,2,3,4-tetrahydroisoquinolin-7-yl)urea derivatives as N-formyl peptide receptor like-1 (FPRL-1) receptor modulators
Polycyclic aryl substituted triazoles and polycyclic heteroaryl substituted triazoles useful as axl inhibitors
2,4-pyrimidinediamine compounds and uses as anti-proliferative agents
Imidazole, pyrazole, and triazole derivatives useful as antibacterial agents
Sulfonamides as TRPM8 modulators
2-hydroxy-6-methyl-heptane derivatives as perfuming ingredients
Probe based nucleic acid detection
Zeolite-palladium complex, method for producing the same, catalyst containing the complex, and method for producing a coupling compound by using the catalyst
Method of etching features in silicon nitride films
Method for reducing topography of non-volatile memory and resulting memory cells
Method for manufacturing a semiconductor device comprising a guard ring between a cell region and a peripheral region
Methods for forming high-K crystalline films and related devices
Leakage barrier for GaN based HEMT active device
Reverse block-type insulated gate bipolar transistor manufacturing method
Curable compositon
Reducing thermal expansion effects in semiconductor packages
Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers
Packaging process tools and packaging methods for semiconductor devices
Micromechanical component and method for producing a micromechanical component having a thin-layer cap