| 摘要 |
PROBLEM TO BE SOLVED: To avoid bending regions having possibility of bending due to the self wt. of a lead frame at molding of a resin, by returning back and removing a pin projected in a region counter to bending in a forming die after the resin is injected in the die. SOLUTION: Part of components to be mounted on a lead frame 10 is supported with an eject pin 110 while a resin is injected in a forming die 100, in which a region having a possibility of bending due to the injected resin pressure or self wt. of the lead frame mounting components is supported with the pin 110 projected in a direction counter to the bending from the die, so as to butt insulative surface of the components located there. Thus, they never become bending at resin forming and never contact the die inner surface and hence the method of manufacturing resin-molded electronic components, molding die and lead frame which avoid bending are obtained. |
