| 摘要 |
PROBLEM TO BE SOLVED: To enhance a fin pedestal in thermal conductivity, by a method wherein heat dissipating fines are provided to the fin pedestal, and the fin pedestal is not divided into two parts by a thermal conductor buried in the fins pedestal. SOLUTION: Heat dissipating fins 1 formed of aluminum material are provided in an array to a fin pedestal 2 of aluminum material, and a thermal conductor 3 formed of cooper plate material higher in thermal conductivity than the fin pedestal 2 is buried in the fin pedestal 2. At this point, when the thermal conductor 3 is buried in the fin pedestal 2, the fin pedestal 2 and the thermal conductor 3 are integrally formed through extrusion molding so as not to drive the fin pedestal 2 into two parts. By this setup, even if a heat dissipating device of this constitution undergoes an expansion/contraction cycle repeatedly, the thermal conductor 3 is hardly separated from the fin pedestal 2, and the fin pedestal 2 can be kept high in thermal conductivity for a long time. |
