| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a heat treating vertical boat of a semiconductor wafer, in which slip pages generated by an inside stress due to the self-weight of a semiconductor wafer can be prevented, and the semiconductor wafer can be automatically carried by a carrying device. SOLUTION: This device is provided with four supporting faces (points) 1, 2, 3, and 4 arranged on the same circumference for supporting a semiconductor wafer SW, and the areas of two triangles constituted by connecting the two supporting faces (points) 1 and 2 provided at the approach front side of the semiconductor wafer SW with one of the supporting faces (points) 3 and 4 at the back side are made the same. Furthermore, the area of each triangle is constituted, so as to be more than 84% of that of an equilateral triangle inscribed to the semiconductor wafer SW.</p> |
