| 摘要 |
PROBLEM TO BE SOLVED: To provide the structure of a package member where a sealing material for sealing a base and a lid airtightly does not fuse owing to the lowering of a melting point and an airtightness property is not lost even if a package member is exposed to a high temperature in, for example, a reflow operation on surface mounting. SOLUTION: A packaging member has a base 1 with a retention electrode layer 5 for accommodating and retaining electronic part elements, a wiring electrode layer 6 for connecting an external circuit, a base 1 having a bond layer in the sealing periphery, a lid 2 for covering the base 1, and a sealing material 3 consisting of a high-temperature solder containing lead(Pb) for sealing the base 1 and the lid airtightly. The retention electrode 5 of the base 1 and the wiring electrode 6 are made of gold(Au) and are as thick as at least 0.5μm and a junction layer 7 of the base 1 is made of gold(Au) and is as thick as 0.3μm or less.
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