发明名称 |
Argon amorphizing polysilicon layer fabrication |
摘要 |
A polycrystalline silicon (polysilicon) layer is fabricated by forming a polysilicon layer on a substrate, implanting argon into the polysilicon layer to selectively amorphize the polysilicon layer and recrystallizing the selectively amorphized polysilicon layer. The argon dosage and energy may be controlled so that the argon passes through the polysilicon layer into the substrate so that argon ions do not disturb recrystallization. By using argon amorphizing, excessive heating of the substrate during implantation is prevented and ion implanter contamination from conventional silicon implantation is prevented.
|
申请公布号 |
US5821157(A) |
申请公布日期 |
1998.10.13 |
申请号 |
US19960632840 |
申请日期 |
1996.04.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JOO-HYUNG;HAN, JAE-JONG |
分类号 |
H01L21/20;(IPC1-7):H01L21/265 |
主分类号 |
H01L21/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|