发明名称 |
Organic substrate (PCB) slip plane stress deflector for flip chip deivces |
摘要 |
A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to "float" and expand at a different rate than the substrate when the package is thermally cycled.
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申请公布号 |
US5804771(A) |
申请公布日期 |
1998.09.08 |
申请号 |
US19960721268 |
申请日期 |
1996.09.26 |
申请人 |
INTEL CORPORATION |
发明人 |
MCMAHON, JOHN F.;MAHAJAN, RAVI |
分类号 |
H01L23/498;H05K1/02;H05K1/11;H05K3/00;H05K3/34;(IPC1-7):H05K1/03 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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