| 摘要 |
PROBLEM TO BE SOLVED: To avoid deteriorating metallized layers due to abrasion of a laser, by providing metallized layers on the upper and lower surfaces of a diamond and protective film as an upper layer, cutting a heat sink using a YAG laser, and removing the protective film. SOLUTION: Metallized layers are provided on the upper and lower surfaces of a diamond, and a locally brazed or solder plated adhesive layer 2 is provided on its one surface metallized layers on the upper and lower surfaces of a diamond and protective film as an upper layer to form protective films on both surfaces thereof. The diamond is cut along parts 3 uncovered with the adhesive layer 2 which are wider than the cutting width by a YAG laser, and the protective film is removed. For cutting by the laser, the diamond can be cut without deteriorating the metallized layers due to abrasion of the laser. |
