| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit module in which connection between an electronic part and a substrate is performed in an excellent manner utilizing such irradiation energy as a laser beam, etc. SOLUTION: Immediately after a bump 2 is melted being irradiated with laser beam LB, the bump 2 is blown by air G1 to forcibly cool and solidify the melted content, thereby the time required for solidification for the melted content is significantly shortened than before. and an electronic part 1 moving due to its own weight and external force to cause slippage of the position is surely prevented, and the electronic part 1 can be connected to a substrate with high positional accuracy. |
