| 摘要 |
PROBLEM TO BE SOLVED: To mold projections on the outer surface of resin mold electronic parts with a projection pin and its pin hole without engraving the mold. SOLUTION: At the position where a mutually openable upper mold 10 and a lower mold 11 are clamped and closed, and the depth of a recess 19 formed with a pin hole 16 of the lower mold 11 and an end face 18 of an ejector pin 17 being movable vertically within the pin hole 16 becomes flush with the height of an external projection 21 of electronic parts 20, a thermosetting resin 30 is injected and then cured from a resin injection part 15 of the lower mold 11 into pattern spaces 12, 13 of the upper and lower molds 10, 11; subsequently, when mold clamping is released, it is pushed out as it were to withdraw therefrom by the ejector pin 17, so that resin mold electronic parts 20 with an external projection 21 is molded. |
