| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacture a high-reliability multi-layer wiring board safely at a low cost, which has a high heat resistance and excellent adhesion between an interlayer insulating layer and a plated conductive layer. SOLUTION: According to this method, a plurality of wiring pattern layers 2 and an interlayer insulating layer 3 are provided at least on one surface of a substrate 1, a via hole 5 is provided for electrically connecting the wiring patterns 2 at a predetermined position of the interlayer insulating layer 3, and then a multi-layer wiring board is produced. At this time, in providing a via hole 5, the surface of the interlayer insulating layer 3 is roughened, a film pattern having a resistance against sandblasting is formed on the interlayer insulating layer 3, next, sandblasting treatment is given for selectively removing the interlayer insulating layer 3, a via hole 5 is formed, a film having the resistance against sandblasting is removed, thereafter, non-electrolytic plate treatment is applied, and a conductive layer is provided inside the via hole 5. |
