发明名称 METAL RELIABILITY TEST AT WAFER LEVEL
摘要 On a aluminum pad of a metal to be tested, drops a first and a second solutions, using a pipette, and records the beginning time. In this case, for the first solution, PAR is used and for the second solution, IPA buffer solution is used. Next, utilizing a microscope, focus on the spot to be measured. As corrosion starts, observe the stability of the aluminum film with VCR and monitor, recording and checking its result. At this time, the stability of the aluminum film is tested by the speed of aluminum corrosion.
申请公布号 KR0123736(B1) 申请公布日期 1997.11.25
申请号 KR19940009303 申请日期 1994.04.29
申请人 SAMSUNG ELECTRONICS CO. 发明人 JOO, JIN-HO;CHON, SANG-MOON;KANG, SUNG-CHOL
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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