| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate processing device which is capable of making a substrate uniform in temperature in a short time and processing it so as to meet its properties. SOLUTION: A substrate processing device processes a substrate S through such manner that the substrate S is placed on a substrate holder 20 arranged in a processing chamber 1, and gas is introduced into the processing chamber 1 to process the substrate S as the substrate S is kept at a prescribed temperature, wherein a holding mechanism 53 which brings the periphery of the wafer S into thermally uniform contact with the substrate holder 20 is provided inside the processing device, and the substrate S can be made uniform in temperature in a short time.</p> |
