| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a chip-scale package having a metallic circuit board so that the package can be mass-produced by electrically connecting the bonding pad of a semiconductor chip to a circuit board through wires. SOLUTION: A semiconductor chip 20 is stuck to a metallic circuit board 22 carrying a prescribed circuit pattern on its surface with a polyimide tape 24. In a package, the size of the board 22 is smaller than that of the chip 20. The chip 20 is electrically connected to the board 22 through wires 26 and protected from the outside with encapsulating resin 28. The electrical connection between the chip 20 and board 20 can be obtained by using the same wiring bonding method as that applied in a plastic packaging process. The encapsulation of the chip 20 is performed so that the surface part of the board 22 on which a mounting pad is formed for electrically connecting the chip to an external terminal can be exposed. In such a way, the mass productivity and yield of the package can be improved by making the assembling process of the package very simple.</p> |
