Verfahren zur Herstellung eines mehrschichtigen Leitersubstrats

摘要

This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate (40) of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer (33) and an insulating layer (32) made of the insulating material for the wiring substrate on a rigid support substrate (30).