| 摘要 |
PURPOSE: To obtain a treatment apparatus in which the rigidity of the holding part of an object to be treated is ensured, in which the generation of particles is suppressed and in which the immersion treatment of the object can be made efficient without being affected by the temperature of a treatment liquid. CONSTITUTION: A treatment apparatus is provided with a treatment tank 15 in which a treatment liquid to immerse and treat a semiconductor wafer W is housed, with a wafer chuck 20 which holds the semiconductor wafer to be conveyed to the treatment tank 15 and with a wafer boat 30 by which the semiconductor wafer W is held to immerse the semiconductor wafer W in the treatment liquid inside the treatment tank 15. Semiconductor wafer holding parts at the wafer chuck 20 and the wafer boat 30 are constituted of corrosion- resistant, heat-resistant and durable base members 26a, 27a, 32a, 33a and of a plurality of corrosion-resistant and heat-resistant synthetic-resin holding groove members 26b, 27b, 32b, 33b in which groove parts 28, 34 mounted so as to be detachable with reference to the base members 26a, 27a, 32a, 33a and so as to be capable of being expanded, contracted and displaced according to the temperature of the treatment liquid are arranged and installed. |
