| 摘要 |
A method for connecting wire leads (7) between a semiconductor circuit chip (1) and corresponding terminal connectors comprises the steps of, providing a bonding tool (9) having a working end (12) formed with at least a pair of grooves (13,14) of different length, holding one end of the wire (7) on the pin in one (13) of said grooves and bonding it, and holding the other end of said wire on the chip (1) in the other (14) of said grooves and bonding it. The grooves (13,14) have different lengths to allow of different wire spans across the bonded connection areas, on the chip and the pins. <IMAGE> <IMAGE> |
| 申请人 |
SGS-THOMSON MICROELECTRONICS S.R.L., AGRATE BRIANZA, MAILAND/MILANO, IT;CO.RI.M.ME. CONSORZIO PER LA RICERCA SULLA MICROELETTRONICANEL MEZZOGIORNO, CATANIA, IT |
发明人 |
GRASSO, ANTONIO, I-95030 GRAVINA DI CATANIA (CT), IT;PINTO, ANTONIO, I-95128 CATANIA, IT |
