Laser beam machining appts. for e.g. hole cutting

摘要

The laser beam machining appts. comprises a control device, a laser oscillator which receives the processing instructions from the control device to generate an output laser beam, and a laser processing machine which receives the laser beam and focuses it on the processed object while moving the processed object corresp. to the processing head according to the processing instruction for movement of the object received from the control device. The control device comprises: (a) a program analysis means, which analyses the processing instructions according to the sequence of the control program and generates and outputs the processing instructions; (b) a processing conditions recording means which receives processing data, e.g. processing of receiving hole, processing prepn., cutting processing, etc., and selectively outputs the processing data; (c) a processing instruction means which receives the processing conditions read from the processing conditions recording means and generates and outputs the processing instructions for the laser oscillator and the movement of the processed object; and (d) a re-start instruction means which receives the signal to release the stop status and re-start and sends out a re-start instruction to the processing instruction part for re-start processing instructions, meanwhile jointly operating with the processing instruction part to recall processing conditions from the processing conditions recording part and uses the processing conditions to modify the processing conditions, from the processing instruction part.