Elektronisches System enthaltend Komponente, die durch einen thermisch leitfähigen Klebstoff verbunden sind.
摘要
<p>Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesive resins have high through-the-thickness thermal conductivity. <IMAGE></p>
申请公布号
DE69113108(T2)
申请公布日期
1996.05.09
申请号
DE1991613108T
申请日期
1991.05.03
申请人
E.I. DU PONT DE NEMOURS & CO., WILMINGTON, DEL., US
发明人
ADAMS, JEROME THOMAS, HOCKESSIN, DELAWARE 19707, US;YOST, BRUCE ALLEN, NEWARK, DELAWARE 19711, US