发明名称 Elektronisches System enthaltend Komponente, die durch einen thermisch leitfähigen Klebstoff verbunden sind.
摘要 <p>Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesive resins have high through-the-thickness thermal conductivity. <IMAGE></p>
申请公布号 DE69113108(T2) 申请公布日期 1996.05.09
申请号 DE1991613108T 申请日期 1991.05.03
申请人 E.I. DU PONT DE NEMOURS & CO., WILMINGTON, DEL., US 发明人 ADAMS, JEROME THOMAS, HOCKESSIN, DELAWARE 19707, US;YOST, BRUCE ALLEN, NEWARK, DELAWARE 19711, US
分类号 C09J11/04;C09J9/02;C09J201/00;H01L23/482;H01L23/498;H05K1/02;H05K3/30;(IPC1-7):C09J9/02;H01L23/373 主分类号 C09J11/04
代理机构 代理人
主权项
地址