发明名称 Deposited film formation method utilizing selective deposition by use of alkyl aluminum hydride
摘要 <p>By providing a deposited film formation method in which aluminum or a metal composed mainly of aluminum of good quality is selectively deposited according to the CVD method utilizing an alkyl aluminum hydride and hydrogen, and then pure aluminum or a metal composed mainly of aluminum is non-selectively deposited, it becomes possible to form an electroconductive film of good quality within fine openings or on an insulating layer.</p>
申请公布号 EP0420595(B1) 申请公布日期 1996.05.01
申请号 EP19900310506 申请日期 1990.09.25
申请人 CANON KABUSHIKI KAISHA 发明人 MIKOSHIBA, NOBUO;TSUBOUCHI, KAZUO;MASU, KAZUYA
分类号 C23C16/20;C23C14/34;C23C16/02;C23C16/04;C23C16/18;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;(IPC1-7):H01L21/285;H01L21/768;H01L21/320 主分类号 C23C16/20
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