| 摘要 |
PROBLEM TO BE SOLVED: To provide an energy sensitive resist material and a device manufacturing process using this material. SOLUTION: The energy sensitive resist material which is a combination of a base body polymer and a condition agent polymer is formed on a substrate. The condition agent polymer and the base body polymer are phase compatible. The condition agent polymer has an average mol.wt. of about 5,000 to about 500,000g/mol and some extent of a polymer chain is terminated at a halogen group. The resist material is exposed in a pattern form to radiations, by which the latent images of the patterns are formed in the resist material. Energy depolymerizes the condition agent polymer. The condition agent polymer has substantially lower solubility in a developer for developing the patterns formed in a resist than the base body polymer. Then, if the resist material is of a positive type, the parts exposed to the radiations are substantially more soluble in the developer than the non-exposed parts. The exposed parts of the resist material are selectively removed. |
