| 摘要 |
PURPOSE:To reduce the size and cost of the surface acoustic wave device. CONSTITUTION:At the peripheral edge part of the IDT electrode surface of a surface acoustic wave element, a circumferential metallic film 4 which is thicker than the film of the IDT electrode 2 is provided and is subjected to plane junction to a terminal conductor 9 provided on the side of a substrate 12 opposite the terminal electrode 3 of the IDT 2 and a circumferential ground conductor 10 provided opposite the circumferential metallic film 4. Consequently, the need for a package is eliminated, so the device is reduced in size and thickness and the fixation of the element, the connection of the electrode and their hermetic sealing are performed by one process at the same time, so that the man-hours are decreased. |
