| 摘要 |
Described is a method of coating printed-circuit boards with a photo-crosslinkable coating material using a roller coating technique, as well as a device for carrying out the method and the further processing of the circuit boards to multi-chip modules. The method is characterized by the following operations: a photopolymerizable 70 to 95 % by wt. coating material containing 10 to 60 % by wt. of acid-soluble filler is held by means of a heated metering roller (3, 4) at a viscosity of 1 to 10 Pa.s and applied to circuit boards at a viscosity of 20 to 100 Pa.s by an application roller (1, 2) cooled to 5 to 20 DEG C to give a coat 10 to 200 mu m thick. For the manufacture of multi-chip modules, 50 mu m microholes are formed, over the conductor paths, in a coat of thickness 100 mu m by photolithographs, the coat roughened with acid, the inside walls of the holes and the coat metallized with copper using an electrochemical technique and 100- to 200- mu m-wide IC terminals produced, after the photo-lithography and electrochemical strengthening operations, by differential etching. The coated circuit boards are dried with a laminar-flow IR/convection drier with a 20- to 100-mm-high drying channel covered with panes of quartz glass, air being blown through the channel in countercurrent flow at a speed greater than 5 m/s and IR radiators being fitted above and below the drying channel in such a way that their position can be adjusted both horizontally and vertically to create a particular temperature profile. |
