| 摘要 |
PURPOSE:To enable a wire bonding device to surely carry out a wire bonding operation at a higher speed by pa method wherein an XY table which moves a capillary in the directions of X, Y is composed of a a first table and a second table both prescribed in structure. CONSTITUTION:A table 11 on which a work where a wire is bonded is placed, a capillary 13 which is supported above the table 11 in a movable manner that it descends to the surface of the work and capable of letting out a bonding wire 13a from its lower end, and an XY table 14 which moves the capillary 13 in directions of X and Y are included in a wire bonding device 10, wherein the XY table 14 is composed of a first table 15 which moves the capillary 13 from a first bonding position to a second bonding position and a second table 16 which is supported in a movable manner that it moves in the directions of X, Y to the first table 15 and capable of carrying out only a reverse operation at bonding. |
