ELECTRONIC CIRCUIT DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To realize complete fusion bonding of an electronic circuit device onto a substrate by providing a protrusion having a melting point higher than that of a protruding contact facing a terminal electrode on a substrate and setting the height of the protrusion lower than that of the protruding contact. CONSTITUTION:Protrusions 3 are provided in same direction as protruding contacts 2 on the same surface of a substrate 6 as the protruding contacts 2 facing terminal electrodes 7 are provided. The protrusion 3 has melting point higher than that of the protruding contact 2 and the height of the protrusion 3 is set equal to or lower than the height for allowing positive electrical connection of all protruding contacts with the terminal electrodes 7 at the time of fusion thereof but higher than the height which causes mutual contact and short circuit of fused protruding contacts 2. This method realizes fusion bonding of an electronic circuit device, e.g. an LSI 1, having a plurality of protruding contacts 2 onto the substrate 6 without causing insufficient contact or short circuit.