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发明名称
METHOD AND APPARATUS FOR ETCHING SILICON SUBSTRATE
摘要
申请公布号
JPH07245291(A)
申请公布日期
1995.09.19
申请号
JP19940033446
申请日期
1994.03.03
申请人
SONY CORP
发明人
OKAMOTO YUTAKA
分类号
H01L21/302;H01L21/3065;(IPC1-7):H01L21/306
主分类号
H01L21/302
代理机构
代理人
主权项
地址
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