| 摘要 |
<p>PURPOSE:To provide excellent dimensional accuracy of a viahole of a polyimide resin film and to accurately expose a surface of an Al bonding pad by increasing the shape and the size of the viahole in a second polyimide resin film larger than those of a viahole in a first polyimide resin film layer. CONSTITUTION:The shape and the size of a viahole in a second polyimide resin film 6 is controlled by regulating the developing and etching times with alkaline aqueous solution to be larger than those of a first layer viahole 5. Then, using the obtained first and second polyimide resin films 4, 6 as mask materials, an inorganic insulating layer 3 of an upper part of an Al bonding pad 2 of a wiring layer is dry-etched by using mixed gas of fluorine, and the pad 2 is exposed. An exposed part 7 is formed in shape smaller than that of the pad of the layer 2, thereby obtaining a moisture resistant reliability of a semiconductor device using it.</p> |
